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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11305986 B1

PDFFull Text
Date of Patent:
Apr. 19, 2022

Filed:

Feb. 21, 2020

Method of manufacturing semiconductor device, substrate processing apparatus and program

Applicant:

Kokusai Electric Corporation, Tokyo, JP;

Inventors:

Takashi Yahata, Toyama, JP;

Naofumi Ohashi, Toyama, JP;

Tadashi Takasaki, Toyama, JP;

Assignee:

KOKUSAI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Asok K Sarkar

Int. Cl.
CPC ...
H01L 21/02 (2006.01); C23C 16/40 (2006.01); B81C 1/00 (2006.01); C23C 16/34 (2006.01); C23C 16/50 (2006.01); H01J 37/32 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00158 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/50 (2013.01); H01J 37/32082 (2013.01); H01J 37/32449 (2013.01); H01L 21/0217 (2013.01); H01L 21/02164 (2013.01); H01L 21/02274 (2013.01); H01J 2237/3321 (2013.01);
Abstract

There is provided a technique for improving a resistance of a film to vibration in a semiconductor device having a vibrating film, including at least: forming a first silicon oxide film; forming a first silicon nitride film; forming a second silicon oxide film; and forming a second silicon nitride film, and each film formation is performed using a substrate processing apparatus configured to supply gas to a process chamber including upper and bottom electrodes, and selectively supply high frequency power or low frequency power to each of the upper and bottom electrodes by switching.

Find Patent Forward Citations

Yahata, Takashi. (2022). Method of manufacturing semiconductor device, substrate processing apparatus and program (U.S. Patent No. 11305986). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11305986

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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