The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 12, 2022

Filed:

Aug. 14, 2020
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Balasubramanian S. Pranatharthi Haran, Watervliet, NY (US);

Devika Sil, Rensselaer, NY (US);

Takeshi Nogami, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01); H01L 21/3213 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/32134 (2013.01); H01L 21/76816 (2013.01); H01L 21/76877 (2013.01); H01L 21/76892 (2013.01); H01L 23/5226 (2013.01);
Abstract

An integrated circuit (IC) structure includes a dielectric layer extending along a first axis to define a length and a second axis orthogonal to the first axis to define a width. A dual-metal via is embedded in the dielectric layer. The dual-metal via includes via sidewalls surrounding a via core. An electrically conductive line extends along the first axis and on an upper surface of the dual-metal via. A side portion of the via core is co-planar with a sidewall of the electrically conductive line.


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