The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 12, 2022
Filed:
Mar. 23, 2020
Applicant:
Macronix International Co., Ltd., Hsinchu, TW;
Inventors:
Dai-Ying Lee, Hsinchu County, TW;
Ming-Hsiu Lee, Hsinchu, TW;
Assignee:
MACRONIX INTERNATIONAL CO., LTD., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 21/48 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 21/486 (2013.01); H01L 21/76897 (2013.01);
Abstract
A semiconductor structure and a manufacturing method for the same. The semiconductor structure includes a plug element and a via element. The plug element includes a tungsten plug. The plug element has a plug size in a lateral direction. The via element is electrically connected on the plug element. The via element is non-symmetrical with respect a center line of the plug element extending along a longitudinal direction. The via element has a via size in the lateral direction. The plug size is bigger than the via size.