The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Dec. 31, 2018
Applicant:
Ningbo Semiconductor International Corporation, Ningbo, CN;
Inventors:
Da Chen, Ningbo, CN;
Mengbin Liu, Ningbo, CN;
Assignee:
Ningbo Semiconductor International Corporation, Ningbo, CN;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01); H01L 23/00 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
H01L 27/1469 (2013.01); H01L 24/48 (2013.01); H01L 27/1462 (2013.01); H01L 27/14618 (2013.01); H01L 27/14627 (2013.01); H01L 27/14634 (2013.01); H01L 27/14636 (2013.01); H01L 27/14685 (2013.01); H01L 31/1892 (2013.01); H01L 2224/48139 (2013.01);
Abstract
The present disclosure provides an image capturing assembly and its packaging method, a lens module and an electronic device. The packaging method includes: providing a photosensitive chip; mounting an optical filter on the photosensitive chip; providing a carrier substrate and temporarily bonding the photosensitive chip and functional components on the carrier substrate; and forming an encapsulation layer on the carrier substrate and at least between the photosensitive chip and the functional components.