The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jun. 23, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Ming Chyi Liu, Hsinchu, TW;

Shih-Chang Liu, Alian Township, TW;

Sheng-Chieh Chen, Taichung, TW;

Yu-Hsing Chang, Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/11521 (2017.01); H01L 21/28 (2006.01); H01L 27/11534 (2017.01); H01L 27/11548 (2017.01); H01L 21/762 (2006.01); H01L 27/11526 (2017.01); H01L 29/423 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
H01L 27/11521 (2013.01); H01L 21/762 (2013.01); H01L 27/11526 (2013.01); H01L 27/11534 (2013.01); H01L 27/11548 (2013.01); H01L 29/40114 (2019.08); H01L 29/42328 (2013.01); H01L 23/528 (2013.01);
Abstract

Various embodiments of the present application are directed to a method for forming an embedded memory boundary structure with a boundary sidewall spacer. In some embodiments, an isolation structure is formed in a semiconductor substrate to separate a memory region from a logic region. A multilayer film is formed covering the semiconductor substrate. A memory structure is formed on the memory region from the multilayer film. An etch is performed into the multilayer film to remove the multilayer film from the logic region, such that the multilayer film at least partially defines a dummy sidewall on the isolation structure. A spacer layer is formed covering the memory structure, the isolation structure, and the logic region, and further lining the dummy sidewall. An etch is performed into the spacer layer to form a spacer on dummy sidewall from the spacer layer. A logic device structure is formed on the logic region.


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