The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Jul. 17, 2019
Applicant:

Advanced Semiconductor Engineering, Inc., Kaohsiung, TW;

Inventors:

Hsun-Wei Chan, Kaohsiung, TW;

Shih-Chieh Tang, Kaohsiung, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H05K 1/183 (2013.01); H05K 2201/10151 (2013.01);
Abstract

A sensor package includes a carrier, a sensor, an interconnection structure, a conductor and a housing. The sensor is disposed on the carrier. The interconnection structure is disposed on the carrier and surrounds the sensor. The interconnection structure has a first surface facing away from the carrier. The conductor is disposed on the first carrier. The conductor having a first portion covered by the interconnection structure and a second portion exposed from the first surface of the interconnection structure. The housing is disposed on the carrier and surrounds the interconnection structure.


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