The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 05, 2022
Filed:
Mar. 12, 2019
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventor:
Yoichiro Ichioka, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/07 (2006.01); G03F 7/075 (2006.01); G03F 7/004 (2006.01); G03F 7/038 (2006.01); G03F 7/105 (2006.01); C08G 73/10 (2006.01); G03F 7/11 (2006.01); G03F 7/115 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0757 (2013.01); G03F 7/0045 (2013.01); G03F 7/0047 (2013.01); G03F 7/038 (2013.01); G03F 7/0385 (2013.01); G03F 7/0387 (2013.01); G03F 7/105 (2013.01); C08G 73/106 (2013.01); G03F 7/0048 (2013.01); G03F 7/11 (2013.01); G03F 7/115 (2013.01);
Abstract
A photosensitive resin composition is provided comprising 100 pbw of a polyimide silicone containing a primary alcoholic hydroxyl group, a crosslinker, a photoacid generator, a polyfunctional epoxy compound, 1-70 pbw of a filler having an average particle size of 0.01-20.0 μm, and 0.01-30 pbw of a colorant. The resin composition is colored and photosensitive and cures into a product having an improved modulus.