The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 05, 2022

Filed:

Oct. 24, 2017
Applicant:

Dowa Metaltech Co., Ltd., Tokyo, JP;

Inventors:

Naota Higami, Tokyo, JP;

Takanobu Sugimoto, Tokyo, JP;

Tomotsugu Aoyama, Tokyo, JP;

Hiroto Narieda, Tokyo, JP;

Assignee:
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C22F 1/08 (2006.01); C22C 9/04 (2006.01); C22C 9/00 (2006.01); H01B 1/02 (2006.01);
U.S. Cl.
CPC ...
C22F 1/08 (2013.01); C22C 9/00 (2013.01); C22C 9/04 (2013.01); H01B 1/026 (2013.01);
Abstract

An inexpensive sheet material of a copper alloy has excellent bending workability and excellent stress corrosion cracking resistance while maintaining high strength. The sheet material is produced by a method including melting and casting raw materials of a copper alloy which has a chemical composition having 17 to 32 wt. % of zinc, 0.1 to 4.5 wt. % of tin, 0.01 to 2.0 wt. % of silicon, 0.01 to 5.0 wt. % of nickel, and the balance being copper and unavoidable impurities; hot-rolling the cast copper alloy at 900° C. to 400° C.; cooling the hot-rolled copper alloy at 1 to 15° C./min. from 400° C. to 300° C.; cold-rolling the cooled copper alloy; recrystallization-annealing the cold-rolled copper alloy at 300 to 800° C.; and then, ageing-annealing the recrystallization-annealed copper alloy at 300 to 600° C.


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