The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Dec. 16, 2015
Applicants:
Alpha Assembly Solutions Inc., South Plainfield, NJ (US);
Advanced Packaging Center Bv, Duiven, NL;
Inventors:
Oscar Khaselev, Monmouth Junction, NJ (US);
Eef Boschman, Aerdt, NL;
Assignees:
Alpha Assembly Solutions, Inc., South Plainfield, NJ (US);
Advanced Packaging Center BV, Duiven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/495 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
H01L 24/84 (2013.01); H01L 21/4825 (2013.01); H01L 23/49524 (2013.01); H01L 24/37 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/92 (2013.01); H01L 24/97 (2013.01); H01L 23/49582 (2013.01); H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/40 (2013.01); H01L 2224/29139 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/37012 (2013.01); H01L 2224/37013 (2013.01); H01L 2224/40105 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/40499 (2013.01); H01L 2224/73213 (2013.01); H01L 2224/73263 (2013.01); H01L 2224/83001 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83191 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83203 (2013.01); H01L 2224/83439 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/83986 (2013.01); H01L 2224/84001 (2013.01); H01L 2224/8484 (2013.01); H01L 2224/84203 (2013.01); H01L 2224/84986 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/9221 (2013.01); H01L 2224/97 (2013.01);
Abstract
A method of die and clip attachment includes providing a clip, a die and a substrate, laminating a sinterable silver film on the clip and the die, depositing a tack agent on the substrate, placing the die on the substrate, placing the clip on the die and the substrate to create a substrate, die and clip package, and sintering the substrate, die and clip package.