The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 29, 2022

Filed:

Feb. 27, 2019
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Christian Ranacher, Gaimberg, AT;

Banafsheh Abasahl, Villach, AT;

Cristina Consani, Villach, AT;

Thomas Grille, Villach, AT;

Peter Irsigler, Obernberg/Inn, AT;

Andreas Tortschanoff, Villach, AT;

Assignee:

INFINEON TECHNOLOGIES AG, Neubiberg, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81B 7/02 (2006.01); B81B 3/00 (2006.01); G02B 26/00 (2006.01); G01J 3/02 (2006.01); G01N 21/3504 (2014.01); G01J 3/42 (2006.01); G01N 21/03 (2006.01); G01J 3/26 (2006.01);
U.S. Cl.
CPC ...
B81B 7/02 (2013.01); B81B 3/0032 (2013.01); G01J 3/021 (2013.01); G01J 3/0202 (2013.01); G01J 3/0291 (2013.01); G01J 3/26 (2013.01); G01J 3/42 (2013.01); G01N 21/031 (2013.01); G01N 21/3504 (2013.01); G02B 26/001 (2013.01); B81B 2201/0214 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/0315 (2013.01); B81B 2203/04 (2013.01);
Abstract

A MEMS component includes a semiconductor substrate stack having a first semiconductor substrate and a second semiconductor substrate, wherein the semiconductor substrate stack has a cavity formed within the first and second semiconductor substrates, and wherein at least the first or the second semiconductor substrate has an access opening for gas exchange between the cavity and an environment. A radiation source is arranged at the first semiconductor substrate, and a radiation detector is arranged at the second semiconductor substrate. Two mutually spaced apart reflection elements are arranged in a beam path between the radiation source and the radiation detector, wherein one reflection element is partly transmissive to the emitted radiation from the cavity in the direction of the radiation detector, and wherein an interspace between the two mutually spaced apart reflection elements has a length that is at least ten times the wavelength of the emitted radiation.


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