The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Feb. 25, 2020
The Goodsystem Corp., Ansan-si, KR;
Dowa Metaltech Co., Ltd., Tokyo, JP;
Meoung-whan Cho, Yongin-si, KR;
Il-ho Kim, Yongin-si, KR;
Seog-woo Lee, Hwaseong-si, KR;
Young-suk Kim, Suwon-si, KR;
Hiroto Narieda, Tokyo, JP;
Tomotsugu Aoyama, Tokyo, JP;
THEGOODSYSTEM CORP., Ansan-si, KR;
DOWA METALTECH CO., LTD., Tokvo, JP;
Abstract
A heat sink plate includes a first layer made of copper (Cu) or a copper (Cu) alloy, a second layer formed on the first layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), a third layer formed on the second layer and made of copper (Cu) or a copper (Cu) alloy, a fourth layer formed on the third layer and made of molybdenum (Mo) or an alloy that includes copper (Cu) and one or more components selected from molybdenum (Mo), tungsten (W), carbon (C), chromium (Cr), titanium (Ti), and beryllium (Be), and a fifth layer formed on the fourth layer and made of copper (Cu) or a copper (Cu) alloy.