The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2022
Filed:
Aug. 02, 2019
Henkel Ag & Co. Kgaa, Duesseldorf, DE;
Heraeus Deutschland Gmbh & Co. KG, Hanau, DE;
Alpha Assembly Solutions Inc., Somerset, NJ (US);
Hans-Jurgen Albrecht, Berlin, DE;
Gunnar Petzold, Dresden, DE;
Klaus Wilke, Berlin, DE;
Klaus Heinrich Georg Bartl, Essen, DE;
Hector Andrew Hamilton Steen, Herts, GB;
Klaus Muller, Bayreuth, DE;
Werner Kruppa, Essen, DE;
Mathias Nowottnick, Berlin, DE;
Klaus Wittke, Berlin, DE;
Henkel AG & Co. KGaA, Duesselford, DE;
Heraeus Duetschland GmbH & Co. KG, Hanau, DE;
Alpha Assembly Solutions Inc., Somerset, NJ (US);
Abstract
The invention relates to a soldering material comprising an alloy that in addition to Sn (tin) as the major constituent, comprises 10 wt. % or less Ag (silver), 10 wt. % or less Bi (bismuth), 10 wt. % or less Sb (antimony) and 3 wt. % or less Cu (copper). Furthermore, the invention relates to a soldering material comprising a plurality of soldering components with such alloy compositions and contents in the soldering material that on fusing the soldering components an alloy is formed that comprises Sn, Ag, Bi, Sb and Cu in the abovementioned alloy contents.