The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Aug. 27, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Eric Lau, Santa Clara, CA (US);

Charles C. Garretson, Sunnyvale, CA (US);

Huanbo Zhang, San Jose, CA (US);

Zhize Zhu, Cupertino, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/66 (2006.01); B25J 9/16 (2006.01); H01L 21/306 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01); B24B 37/30 (2012.01); B24B 49/12 (2006.01);
U.S. Cl.
CPC ...
H01L 22/26 (2013.01); B24B 37/30 (2013.01); B24B 49/12 (2013.01); B25J 9/1628 (2013.01); H01L 21/30625 (2013.01); H01L 21/67219 (2013.01); H01L 21/67253 (2013.01); H01L 21/68707 (2013.01); H01L 22/20 (2013.01); H01L 22/12 (2013.01);
Abstract

A chemical mechanical polishing system includes a metrology station having a sensor configured to measure a thickness profile of a substrate, a robotic arm configured to transfer the substrate from the metrology station to a polishing station having, a platen to support a polishing pad having a polishing surface, a carrier head on the polishing surface, the carrier head having a membrane configured to apply pressure to the substrate in the carrier head, and a controller configured to receive measurements from the sensor and configured to control the robotic arm to orient the substrate in the carrier head according to substrate profile and a removal profile for the carrier head.


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