The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 22, 2022
Filed:
Apr. 28, 2019
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Sang-Ho Yu, Cupertino, CA (US);
Seshadri Ganguli, Sunnyvale, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 21/02 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76879 (2013.01); H01L 21/0228 (2013.01); H01L 21/28568 (2013.01); H01L 21/76856 (2013.01); H01L 23/5226 (2013.01);
Abstract
Methods and apparatus for filling a high aspect ratio feature such as a via with ruthenium including: contacting a ruthenium liner with a ruthenium precursor within a high aspect ratio feature such as a via, wherein the ruthenium liner has a top surface within a high aspect ratio feature such as a via, and wherein the top surface comprises a halogen material such as iodine or bromine. Embodiments also relate to selective deposition of ruthenium within a high-aspect ratio feature such as a via.