The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 22, 2022

Filed:

Nov. 08, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Mukta Ghate Farooq, Hopewell Junction, NY (US);

James Kelly, Schenectady, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/538 (2006.01); H01L 21/48 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 21/4853 (2013.01); H01L 21/4857 (2013.01); H01L 23/3121 (2013.01); H01L 23/5381 (2013.01); H01L 23/5386 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01);
Abstract

A method of forming a planarized integration structure is provided. The method includes forming at least two conductive pillars on a packaging substrate, wherein the packaging substrate has a positive or convex meniscus shape. The method further includes placing a bridging die on the packaging substrate between an adjacent pair of the at least two conductive pillars, wherein the bridging die includes one or more conductive interconnects. The method further includes forming a cover layer on the substrate over the at least two conductive pillars and the bridging die, and planarizing the conductive pillars and the one or more conductive interconnects.


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