The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Aug. 23, 2019
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Tatsuo Shimizu, Shinagawa, JP;

Toshiyuki Oshima, Bunkyo, JP;

Ryosuke Iijima, Setagaya, JP;

Hisashi Yoshida, Kawasaki, JP;

Shigeya Kimura, Yokohama, JP;

Assignee:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/778 (2006.01); H01L 29/16 (2006.01); H01L 29/51 (2006.01); H01L 29/423 (2006.01); B60L 50/51 (2019.01); B66B 11/04 (2006.01); H02M 7/537 (2006.01); H02P 27/06 (2006.01);
U.S. Cl.
CPC ...
H01L 29/7786 (2013.01); B60L 50/51 (2019.02); B66B 11/043 (2013.01); H01L 29/1608 (2013.01); H01L 29/4236 (2013.01); H01L 29/518 (2013.01); H02M 7/537 (2013.01); B60L 2200/26 (2013.01); H02P 27/06 (2013.01);
Abstract

An embodiment of a semiconductor device including a silicon carbide layer having a first and a second planes; a first silicon carbide region of first conductivity type in the silicon carbide layer; a second silicon carbide region of second conductivity type in the silicon carbide layer between the first silicon carbide region and the first plane; a third silicon carbide region of the first conductivity type in the silicon carbide layer located between the second silicon carbide region and the first plane; a first electrode located on a side of the first plane; a second electrode located on a side of the second plane; a gate electrode; an aluminum nitride layer containing an aluminum nitride crystal between the second silicon carbide region and the gate electrode; and an insulating layer between the aluminum nitride layer and the gate electrode and having a wider band gap than the aluminum nitride layer.


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