The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Feb. 21, 2020
Applicant:

Kabushiki Kaisha Toshiba, Minato-ku, JP;

Inventors:

Shinya Kyogoku, Tsukuba, JP;

Toshiyuki Oshima, Bunkyo, JP;

Ryosuke Iijima, Setagaya, JP;

Assignee:

KABUSHIKI KAISHA TOSHIBA, Minato-ku, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 29/16 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01); H01L 21/04 (2006.01); H01L 29/66 (2006.01); B66B 11/04 (2006.01); H02P 27/06 (2006.01); B60K 1/00 (2006.01); B60R 16/023 (2006.01); B61C 3/00 (2006.01);
U.S. Cl.
CPC ...
H01L 29/063 (2013.01); H01L 21/049 (2013.01); H01L 21/0465 (2013.01); H01L 21/0475 (2013.01); H01L 29/1095 (2013.01); H01L 29/1608 (2013.01); H01L 29/66068 (2013.01); H01L 29/7813 (2013.01); B60K 1/00 (2013.01); B60R 16/0231 (2013.01); B61C 3/00 (2013.01); B66B 11/043 (2013.01); H02P 27/06 (2013.01);
Abstract

A semiconductor device of an embodiment includes a silicon carbide layer having first and second plane, the silicon carbide layer including trench having a first portion and a second portion, the second portion having a width smaller than the first portion, an n-type first silicon carbide region, a p-type second silicon carbide region between the first silicon carbide region and the first plane, a p-type third silicon carbide region between the second silicon carbide region and the first plane and having a p-type impurity concentration lower than the second silicon carbide region, an n-type fourth silicon carbide region between the third silicon carbide region and the first plane, and an n-type fifth silicon carbide region between the second portion and the second silicon carbide region and having an n-type impurity concentration higher than the first silicon carbide region; and a gate electrode in the trench.


Find Patent Forward Citations

Loading…