The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Jun. 06, 2017
Applicants:

Shanghai Ic R&d Center Co., Ltd., Shanghai, CN;

Chengdu Image Design Technology Co. Ltd., Chengdu, CN;

Inventor:

Yong Wang, Shanghai, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/146 (2006.01);
U.S. Cl.
CPC ...
H01L 27/14605 (2013.01); H01L 27/14685 (2013.01); H01L 27/14627 (2013.01); H01L 27/14636 (2013.01);
Abstract

The present disclosure refers to a multispectral image sensor and a manufacturing method thereof. The multispectral image sensor comprises a front-end structure used for photoelectric conversion and processing, and a pixel layer provided on the front-end structure. The pixel layer comprises N pixel units, and N≥4, the pixel units are arranged in a plurality of arrays, a photosensitive wavelength of each pixel unit in each array is different. Whereby, multispectrals can be detected simultaneously, and therefore the efficiency is improved, costs are reduced, and miniaturization is achieved.


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Wang, Yong. (2022). Multispectral image sensor and manufacturing method thereof (U.S. Patent No. 11276717). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11276717

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