The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Aug. 27, 2019
Applicant:
Sandisk Technologies Llc, Addison, TX (US);
Inventors:
Chen Wu, Leuven, BE;
Peter Rabkin, Cupertino, CA (US);
Yangyin Chen, Leuven, BE;
Masaaki Higashitani, Cupertino, CA (US);
Assignee:
SANDISK TECHNOLOGIES LLC, Addison, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/1158 (2017.01); H01L 27/11573 (2017.01); H01L 27/11565 (2017.01); H01L 27/1157 (2017.01); H01L 27/11524 (2017.01); H01L 27/11514 (2017.01); H01L 27/11519 (2017.01); H01L 27/11553 (2017.01); H01L 27/11504 (2017.01); H01L 27/11507 (2017.01); H01L 27/11529 (2017.01);
U.S. Cl.
CPC ...
H01L 27/1158 (2013.01); H01L 27/1157 (2013.01); H01L 27/11504 (2013.01); H01L 27/11507 (2013.01); H01L 27/11514 (2013.01); H01L 27/11519 (2013.01); H01L 27/11524 (2013.01); H01L 27/11529 (2013.01); H01L 27/11553 (2013.01); H01L 27/11565 (2013.01); H01L 27/11573 (2013.01);
Abstract
A semiconductor structure includes a first semiconductor die containing a recesses, and a second semiconductor die which is embedded in the recess in the first semiconductor die and is bonded to the first semiconductor die.