The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 15, 2022

Filed:

Nov. 16, 2017
Applicant:

Kla-tencor Corporation, Milpitas, CA (US);

Inventor:

Arpit Yati, Lucknow, IN;

Assignee:

KLA-Tencor Corporation, Milpitas, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G05B 19/418 (2006.01); G05B 13/02 (2006.01);
U.S. Cl.
CPC ...
G05B 19/41875 (2013.01); G05B 13/027 (2013.01); G05B 2219/32186 (2013.01); G05B 2219/37109 (2013.01); G05B 2219/37208 (2013.01); G05B 2219/45031 (2013.01);
Abstract

An initial inspection or critical dimension measurement can be made at various sites on a wafer. The location, design clips, process tool parameters, or other parameters can be used to train a deep learning model. The deep learning model can be validated and these results can be used to retrain the deep learning model. This process can be repeated until the predictions meet a detection accuracy threshold. The deep learning model can be used to predict new probable defect location or critical dimension failure sites.


Find Patent Forward Citations

Yati, Arpit. (2022). Systems and methods for predicting defects and critical dimension using deep learning in the semiconductor manufacturing process (U.S. Patent No. 11275361). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11275361

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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