The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 15, 2022
Filed:
Sep. 27, 2017
Applicant:
Kuprion Inc., San Jose, CA (US);
Inventors:
Zhenggang Li, Singapore, SG;
Yeng Ming Lam, Singapore, SG;
Chee Lip Gan, Singapore, SG;
Jaewon Kim, Singapore, SG;
Alfred A. Zinn, Bethesda, MD (US);
Assignee:
Kuprion Inc., San Jose, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 11/52 (2014.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); H01B 1/22 (2006.01); H01B 1/02 (2006.01); H05K 1/09 (2006.01); B82Y 40/00 (2011.01); C09D 5/24 (2006.01); B22F 1/00 (2022.01); B41M 5/00 (2006.01); B41M 7/00 (2006.01); C09D 11/033 (2014.01); C09D 11/037 (2014.01); C09D 11/38 (2014.01); H01B 5/14 (2006.01); H01B 13/00 (2006.01); H05K 3/12 (2006.01); B82Y 30/00 (2011.01); B33Y 70/00 (2020.01); B22F 7/08 (2006.01); B22F 10/10 (2021.01);
U.S. Cl.
CPC ...
C09D 11/52 (2013.01); B22F 1/0014 (2013.01); B22F 1/0022 (2013.01); B41M 5/0023 (2013.01); B41M 7/009 (2013.01); B82Y 40/00 (2013.01); C09D 5/24 (2013.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/38 (2013.01); H01B 1/026 (2013.01); H01B 1/22 (2013.01); H01B 5/14 (2013.01); H01B 13/0016 (2013.01); H05K 1/097 (2013.01); H05K 3/1283 (2013.01); B22F 1/0062 (2013.01); B22F 7/08 (2013.01); B22F 10/10 (2021.01); B22F 2998/10 (2013.01); B22F 2999/00 (2013.01); B33Y 70/00 (2014.12); B82Y 30/00 (2013.01); H05K 2201/0245 (2013.01); H05K 2201/0257 (2013.01); H05K 2201/0266 (2013.01); H05K 2201/0272 (2013.01);
Abstract
According to embodiments of the present invention, an ink composition is provided. The ink composition includes a plurality of nanostructures distributed in at least two cross-sectional dimension ranges, wherein each nanostructure of the plurality of nanostructures is free of a cross-sectional dimension of more than 200 nm. According to further embodiments of the present invention, a method for forming a conductive member and a conductive device are also provided.