The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Jan. 28, 2020
Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Jiao Jia, Chengdu, CN;

Zhipeng Feng, Sichuan, CN;

He Lin, Frisco, TX (US);

Yunlong Liu, Chengdu, CN;

Manoj Jain, Plano, TX (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01L 21/3215 (2006.01); H01L 21/3213 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/3205 (2006.01); H01L 25/18 (2006.01); H01L 21/306 (2006.01); H01L 29/78 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 28/60 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/02164 (2013.01); H01L 21/02236 (2013.01); H01L 21/02532 (2013.01); H01L 21/02595 (2013.01); H01L 21/30604 (2013.01); H01L 21/32055 (2013.01); H01L 21/32134 (2013.01); H01L 21/32139 (2013.01); H01L 21/32155 (2013.01); H01L 21/76831 (2013.01); H01L 23/49503 (2013.01); H01L 23/49575 (2013.01); H01L 23/562 (2013.01); H01L 25/18 (2013.01); H01L 28/00 (2013.01); H01L 21/02255 (2013.01); H01L 23/3121 (2013.01); H01L 24/40 (2013.01); H01L 24/48 (2013.01); H01L 29/7802 (2013.01); H01L 2224/40245 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48247 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/13055 (2013.01); H01L 2924/13091 (2013.01);
Abstract

A trench capacitor includes a plurality of trenches in a semiconductor substrate. A first polysilicon layer is located within the plurality of trenches and over a top surface of the substrate. The first polysilicon layer is continuous between the plurality of trenches. The trench capacitor further includes a plurality of second polysilicon layers. Each of the second polysilicon layers fills a corresponding trench of the plurality of trenches. The second polysilicon layers each extend to a top surface of the first polysilicon layer.


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