The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
Jan. 05, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 21/66 (2006.01); H01L 23/36 (2006.01); H01L 25/04 (2014.01);
U.S. Cl.
CPC ...
H01L 23/49551 (2013.01); H01L 22/30 (2013.01); H01L 23/36 (2013.01); H01L 25/04 (2013.01);
Abstract
A semiconductor chip () having flexibility is bonded to a heat radiation material () with solder. The semiconductor chip () is pressed by a tip of a pressing member () from an upper side. As a result, convex warpage of the semiconductor chip () can be suppressed. Furthermore, since voids can be prevented from remaining in the solder (), the heat radiation of the semiconductor device can be enhanced.