The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 08, 2022
Filed:
May. 06, 2020
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Chao-Tung Wu, Taichung, TW;
Kuo-Chung Yu, Tainan, TW;
Chung-Hao Hu, Hsinchu, TW;
Sheng-Ping Weng, Tainan, TW;
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Abstract
A method for inspecting a wafer includes: transferring the wafer from a transfer chamber to an annealing station by a robot arm; and monitoring at least one portion of an edge bevel removal area of the wafer over the robot arm when the wafer is transferred from the transfer chamber to the annealing station. The at least one portion of the edge bevel removal area includes a first portion and a second portion different from the first portion. When the wafer is passing through a predetermined location between the transfer chamber and the annealing station, a first charge-coupled device sensor located over the first portion of the edge bevel removal area is used to capture an image of the first portion, and a second charge-coupled device sensor located over the second portion of the edge bevel removal area is used to capture an image of the second portion.