The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Jun. 14, 2016
Applicant:

Versum Materials Us, Llc, Tempe, AZ (US);

Inventors:

Xinjian Lei, Vista, CA (US);

Jianheng Li, Santa Clara, CA (US);

John Francis Lehmann, Bethlehem, PA (US);

Alan Charles Cooper, Macungie, PA (US);

Assignee:

Versum Materials US, LLC, Tempe, AZ (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/22 (2006.01); C23C 16/34 (2006.01); B01J 29/40 (2006.01); C23C 16/02 (2006.01); C23C 16/36 (2006.01); C23C 16/44 (2006.01); C23C 16/448 (2006.01); C23C 16/455 (2006.01);
U.S. Cl.
CPC ...
C23C 16/345 (2013.01); B01J 29/40 (2013.01); C23C 16/0254 (2013.01); C23C 16/36 (2013.01); C23C 16/4404 (2013.01); C23C 16/4488 (2013.01); C23C 16/45536 (2013.01); C23C 16/45553 (2013.01);
Abstract

Processes for depositing silicon-containing films (e.g., silicon, amorphous silicon, silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon carbonitride, doped silicon films, and metal-doped silicon nitride films) are performed using halidosilane precursors. Examples of halidosilane precursor compounds described herein, include, but are not limited to, monochlorodisilane (MCDS), monobromodisilane (MBDS), monoiododisilane (MIDS), monochlorotrisilane (MCTS), and monobromotrisilane (MBTS), monoiodotrisilane (MITS). Also described herein are methods for depositing silicon containing films such as, without limitation, silicon, amorphous silicon, silicon oxide, silicon nitride, silicon carbide, silicon oxynitride, silicon carbonitride, doped silicon films, and metal-doped silicon nitride films, at one or more deposition temperatures of about 500° C. or less.


Find Patent Forward Citations

Loading…