The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 08, 2022

Filed:

Dec. 18, 2015
Applicant:

Dupont-mitsui Fluorochemicals Co., Ltd., Tokyo, JP;

Inventors:

Takahiro Nishimura, Shizuoka, JP;

Hitomi Nishimura, Shizuoka, JP;

Chorong Jeong, Shizuoka, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 71/02 (2006.01); B29K 27/12 (2006.01); C08F 214/26 (2006.01);
U.S. Cl.
CPC ...
B29C 71/02 (2013.01); B29C 2071/022 (2013.01); B29K 2027/12 (2013.01); C08F 214/262 (2013.01);
Abstract

Provided is a molded body with a hollow portion comprising tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer, which is obtained by heat treating a molded body with a hollow portion obtained by melt molding tetrafluoroethylene and perfluoro(alkyl vinyl ether) copolymer having a melt flow rate of 0.1 to 100 g/10 min when measured with a load of 5 kg and a measurement temperature of 372±0.1° C. in accordance with ASTM D1238. The heat treatment is carried out at a temperature from 130° C. below the melting point of the copolymer to the melting point of the copolymer. The molded body exhibits excellent blister resistance when utilized in contact with harsh chemicals and under harsh operating conditions.


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