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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11264750 B1

PDFFull Text
Date of Patent:
Mar. 01, 2022

Filed:

May. 15, 2018

Tin-plated copper terminal material, terminal, and electric-wire terminal structure

Applicant:

Mitsubishi Materials Corporation, Tokyo, JP;

Inventors:

Kenji Kubota, Naka, JP;

Yoshie Tarutani, Naka, JP;

Kiyotaka Nakaya, Naka, JP;

Assignee:

MITSUBISHI MATERIALS CORPORATION, Tokyo, JP;

Attorneys:

Locke Lord LLP

James E. Armstrong, IV

Nicholas J. DiCeglie, Jr.

Primary Examiner:

Humera N Sheikh

Assistant Examiner:

John D Schneible

Int. Cl.
CPC ...
H01R 13/03 (2006.01); H01R 4/18 (2006.01); H01R 4/62 (2006.01); C25D 5/12 (2006.01); C22C 18/00 (2006.01); C25D 5/10 (2006.01); C25D 7/00 (2006.01); C25D 5/00 (2006.01); C22C 13/00 (2006.01); H01B 1/02 (2006.01); B32B 15/20 (2006.01);
U.S. Cl.
CPC ...
H01R 13/03 (2013.01); C22C 18/00 (2013.01); C25D 5/10 (2013.01); C25D 5/12 (2013.01); C25D 5/617 (2020.08); C25D 7/00 (2013.01); H01R 4/185 (2013.01); H01R 4/62 (2013.01); B32B 15/20 (2013.01); B32B 2250/03 (2013.01); B32B 2255/06 (2013.01); B32B 2255/205 (2013.01); C22C 13/00 (2013.01); H01B 1/026 (2013.01); Y10T 428/12708 (2015.01); Y10T 428/12715 (2015.01);
Abstract

Provided is a tin-plated copper terminal material, a terminal formed from the terminal material, and an electric-wire terminal structure using the terminal: the terminal material has a substrate of copper or a copper alloy; an intermediate zinc layer of a zinc alloy that is formed on the substrate and has a thickness of 0.10 μm to 5.00 μm; and a tin layer of tin or a tin alloy that is formed on the intermediate zinc layer and in which the length proportion occupied by low-angle grain boundaries is 2% to 30% with respect to the total length of all crystal grain boundaries; wherein galvanic corrosion is effectively suppressed.

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Kubota, Kenji. (2022). Tin-plated copper terminal material, terminal, and electric-wire terminal structure (U.S. Patent No. 11264750). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11264750

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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