The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Nov. 26, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Wei Cheng Wu, Zhubei, TW;
Chien-Hung Chang, Taipei, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
In some embodiments, the present disclosure relates to a method of forming an integrated chip. The method includes forming a plurality of memory devices within an embedded memory region of a substrate and forming a plurality of transistor devices within a logic region of the substrate. A first isolation structure is formed within a boundary region of the substrate disposed between the logic region and the embedded memory region. The first isolation structure is formed within a recess in the substrate. A logic wall is formed over the first isolation structure. The logic wall surrounds the embedded memory region and has a first height that is greater than heights of the plurality of memory devices.