The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Jan. 02, 2020
Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;

Inventors:

Lee-Chuan Tseng, New Taipei, TW;

Chang-Ming Wu, New Taipei, TW;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B81C 1/00 (2006.01); B81B 7/02 (2006.01); B81B 3/00 (2006.01); H01L 21/768 (2006.01); B81B 7/00 (2006.01); B81C 3/00 (2006.01); H01L 23/532 (2006.01); H01L 23/522 (2006.01); H01L 23/528 (2006.01);
U.S. Cl.
CPC ...
B81C 1/00166 (2013.01); B81B 3/001 (2013.01); B81B 3/0005 (2013.01); B81B 3/0008 (2013.01); B81B 3/0075 (2013.01); B81B 7/02 (2013.01); B81C 1/0023 (2013.01); B81C 1/00238 (2013.01); B81C 1/00246 (2013.01); B81C 1/00404 (2013.01); B81C 1/00531 (2013.01); B81C 1/00563 (2013.01); B81C 1/00619 (2013.01); B81C 1/00626 (2013.01); B81C 1/00952 (2013.01); B81C 1/00984 (2013.01); H01L 21/76834 (2013.01); B81B 7/0006 (2013.01); B81B 7/0032 (2013.01); B81B 2201/01 (2013.01); B81B 2201/0235 (2013.01); B81B 2201/0242 (2013.01); B81B 2201/0257 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/03 (2013.01); B81B 2201/054 (2013.01); B81B 2203/0109 (2013.01); B81B 2203/0118 (2013.01); B81B 2203/0163 (2013.01); B81B 2203/04 (2013.01); B81B 2203/053 (2013.01); B81B 2207/015 (2013.01); B81B 2207/07 (2013.01); B81B 2207/09 (2013.01); B81C 1/0015 (2013.01); B81C 1/00142 (2013.01); B81C 1/00269 (2013.01); B81C 3/001 (2013.01); B81C 2201/016 (2013.01); B81C 2201/0132 (2013.01); B81C 2201/112 (2013.01); B81C 2201/115 (2013.01); B81C 2203/0118 (2013.01); B81C 2203/032 (2013.01); B81C 2203/035 (2013.01); B81C 2203/0735 (2013.01); B81C 2203/0771 (2013.01); B81C 2203/0792 (2013.01); H01L 21/7684 (2013.01); H01L 21/76807 (2013.01); H01L 21/76835 (2013.01); H01L 21/76879 (2013.01); H01L 23/5226 (2013.01); H01L 23/5283 (2013.01); H01L 23/53214 (2013.01); H01L 23/53219 (2013.01); H01L 23/53228 (2013.01); H01L 23/53242 (2013.01); H01L 23/53257 (2013.01); H01L 23/53261 (2013.01); H01L 23/53295 (2013.01);
Abstract

The present disclosure relates to a microelectromechanical systems (MEMS) package featuring a flat plate having a raised edge around its perimeter serving as an anti-stiction device, and an associated method of formation. A CMOS IC is provided having a dielectric structure surrounding a plurality of conductive interconnect layers disposed over a CMOS substrate. A MEMS IC is bonded to the dielectric structure such that it forms a cavity with a lowered central portion the dielectric structure, and the MEMS IC includes a movable mass that is arranged within the cavity. The CMOS IC includes an anti-stiction plate disposed under the movable mass. The anti-stiction plate is made of a conductive material and has a raised edge surrounding at least a part of a perimeter of a substantially planar upper surface.


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