The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Nov. 13, 2017
Corning Incorporated, Corning, NY (US);
Christina Sue Bennett, Hammondsport, NY (US);
Raymond Charles Cady, Horseheads, NY (US);
Hyun-Soo Choi, Cheonan-si, KR;
Claire Renata Coble, Horseheads, NY (US);
Byungchul Kim, Asan, KR;
Timothy Michael Miller, Elmira, NY (US);
Joseph William Soper, Arkport, NY (US);
Gary Carl Weber, Horseheads, NY (US);
CORNING INCORPORATED, Corning, NY (US);
Abstract
A method of processing a substrate, with a first major surface of the substrate removably bonded to a first major surface of a first carrier and a second major surface of the substrate removably bonded to a first major surface of a second carrier, includes initiating debonding at a first location of an outer peripheral bonded interface between the substrate and the first carrier to separate a portion of the first carrier from the substrate. The method further includes propagating a first debond front from the first debonded location along a first direction extending away from the first debonded location by sequentially applying a plurality of lifting forces to the first carrier at a corresponding plurality of sequential lifting locations of the first carrier.