The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 01, 2022
Filed:
Oct. 16, 2018
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Ji James Cui, Hsinchu, TW;
Feng Yuan Hsu, Yilan County, TW;
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
B24B 37/013 (2012.01); H01L 21/67 (2006.01); B24B 49/12 (2006.01); B24B 37/26 (2012.01); B24B 37/24 (2012.01); B24B 37/22 (2012.01);
U.S. Cl.
CPC ...
B24B 37/013 (2013.01); B24B 37/22 (2013.01); B24B 37/24 (2013.01); B24B 37/26 (2013.01); B24B 49/12 (2013.01); H01L 21/67253 (2013.01);
Abstract
A polishing pad for CMP is provided. The polishing pad includes a layer of material having a surface, a plurality of grooves indented into the surface in the layer of material, and a fluorescent indicator in the layer of material. Each of the plurality of grooves has a first depth, the fluorescent indicator has a second depth, and the second depth is equal to or less than the first depth.