The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 01, 2022

Filed:

Aug. 25, 2020
Applicants:

Screen Holdings Co., Ltd., Kyoto, JP;

Merck Patent Gmbh, Darmstadt, DE;

Inventors:

Yukifumi Yoshida, Kyoto, JP;

Manabu Okutani, Kyoto, JP;

Shuichi Yasuda, Kyoto, JP;

Yasunori Kanematsu, Kyoto, JP;

Dai Ueda, Kyoto, JP;

Song Zhang, Kyoto, JP;

Tatsuro Nagahara, Kakegawa, JP;

Takafumi Kinuta, Kakegawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); B08B 7/00 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); B08B 3/10 (2006.01); C11D 3/20 (2006.01); C11D 3/37 (2006.01);
U.S. Cl.
CPC ...
B08B 7/0014 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); B08B 3/10 (2013.01); C11D 3/2058 (2013.01); C11D 3/3703 (2013.01);
Abstract

A substrate processing method includes a processing liquid supplying step of supplying a processing liquid having a solute and a solvent to a front surface of a substrate, a processing film forming step of forming on the front surface of the substrate a processing film which holds a removal object present on the front surface of the substrate by solidifying or curing the processing liquid supplied to the front surface of the substrate, and a peeling step of peeling the processing film from the front surface of the substrate together with the removal object by supplying a peeling liquid to the front surface of the substrate, and the peeling step includes a penetrating hole forming step of forming a penetrating hole on the processing film by dissolving partially the processing film in the peeling liquid.


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