The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Feb. 28, 2017
Applicant:

Chinese Academy of Sciences Institute of Geology and Geophysics, Beijing, CN;

Inventors:

Kevin Chau, Beijing, CN;

Man Wong, Hong Kong, CN;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G01L 9/06 (2006.01); G01L 9/00 (2006.01); E21B 47/017 (2012.01); E21B 47/06 (2012.01);
U.S. Cl.
CPC ...
G01L 9/0052 (2013.01); E21B 47/017 (2020.05); E21B 47/06 (2013.01); G01L 9/0048 (2013.01); G01L 9/06 (2013.01);
Abstract

The present invention is related to a sensor. In particular, the present invention is related to a pressure sensor die and its fabrication process. The pressure sensor comprises a chamber inside which a pressure sensor die is provided. The pressure sensor die is uniformly compressed by the external pressure to be measured and can deform freely inside the chamber. The pressure sensor die is primarily constructed of single crystalline silicon and comprises a substrate and a cap connected together. A recess is formed on the cap. The recess forms a sealed cavity with the substrate. A silicon oxide layer is formed between the substrate and the cap. The substrate further comprises a plurality of piezoresistive sensing elements which are located inside the sealed cavity. The present pressure sensor is more immune to temperature effects. It is especially suitable for operating in a high temperature, high pressure environment and is capable of delivering accurate and reliable pressure measurements at low cost.


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