The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Mar. 01, 2019
Applicant:
Hitachi Chemical Company, Ltd., Tokyo, JP;
Inventors:
Assignee:
Showa Denko Materials Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 11/06 (2006.01); C09J 201/02 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/568 (2013.01); C09J 7/25 (2018.01); C09J 7/35 (2018.01); C09J 11/06 (2013.01); C09J 201/02 (2013.01); H01L 21/561 (2013.01); H01L 21/565 (2013.01); H01L 23/49503 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01);
Abstract
Disclosed is a temporary protective film for semiconductor sealing molding comprising: a support film; and an adhesive layer provided on one surface or both surfaces of the support film and containing a resin and a silane coupling agent, and the content of the silane coupling agent in the temporary protective film may be more than 5% by mass and less than or equal to 35% by mass with respect to the total mass of the resin.