The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Oct. 15, 2020
Applicant:

United Semiconductor (Xiamen) Co., Ltd., Fujian, CN;

Inventors:

Ji He Huang, Suzhou, CN;

Wen Yi Tan, Fujian, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 49/02 (2006.01); H01L 23/522 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 28/56 (2013.01); H01L 23/5223 (2013.01); H01L 23/5226 (2013.01); H01L 28/40 (2013.01); H01L 28/60 (2013.01); H01L 28/75 (2013.01); H01L 28/91 (2013.01); H01L 21/76802 (2013.01); H01L 21/76807 (2013.01);
Abstract

An MIM capacitor includes a semiconductor substrate having a conductor layer thereon, a dielectric layer overlying the semiconductor substrate and the conductor layer, and a first capacitor electrode disposed on the dielectric layer. The first capacitor electrode partially overlaps with the conductor layer when viewed from above. A capacitor dielectric layer is disposed on the first capacitor electrode. A second capacitor electrode is disposed on the capacitor dielectric layer. At least one via is disposed in the dielectric layer and electrically connecting the first capacitor electrode with the conductor layer.


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