The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Sep. 08, 2020
Applicant:

Skyworks Solutions, Inc., Irvine, CA (US);

Inventors:

Robert Francis Darveaux, Corona Del Mar, CA (US);

Howard E. Chen, Anaheim, CA (US);

Hoang Mong Nguyen, Fountain Valley, CA (US);

Assignee:

SKYWORKS SOLUTIONS, INC., Irvine, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 23/552 (2006.01); H01L 23/00 (2006.01); H01L 23/544 (2006.01); H01L 21/268 (2006.01); H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 23/31 (2006.01); H01L 23/538 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01); H01L 23/29 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H01L 21/027 (2006.01);
U.S. Cl.
CPC ...
H01L 21/563 (2013.01); H01L 21/268 (2013.01); H01L 21/481 (2013.01); H01L 21/4853 (2013.01); H01L 21/4864 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6836 (2013.01); H01L 21/78 (2013.01); H01L 23/293 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/544 (2013.01); H01L 23/552 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/73 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01); H01L 21/0274 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 24/48 (2013.01); H01L 24/81 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 25/16 (2013.01); H01L 2223/54486 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/26175 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/32155 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/32227 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/831 (2013.01); H01L 2224/83002 (2013.01); H01L 2224/83007 (2013.01); H01L 2224/83855 (2013.01); H01L 2224/92125 (2013.01); H01L 2224/92225 (2013.01); H01L 2224/92247 (2013.01); H01L 2225/0651 (2013.01); H01L 2225/06517 (2013.01); H01L 2225/06572 (2013.01); H01L 2225/06586 (2013.01); H01L 2924/0665 (2013.01); H01L 2924/1421 (2013.01); H01L 2924/19011 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Disclosed herein are methods of fabricating a packaged radio-frequency (RF) device. The disclosed methods use a film during fabrication to control the distribution of an under-fill material between one or more components and a packaging substrate. The method includes mounting components to a first side of a packaging substrate and applying a film to a second side of a packaging substrate. The method also includes mounting a lower component to the second side of the packaging substrate and under-filling the lower component mounted on the second side of the packaging substrate with an under-filling agent. The method also includes removing the film on the second side of the packaging substrate and mounting solder balls to the second side of the packaging substrate after removal of the film.


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