The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Oct. 09, 2018
Applicant:
Applied Materials, Inc., Santa Clara, CA (US);
Inventors:
Rui Cheng, Santa Clara, CA (US);
Yihong Chen, San Jose, CA (US);
Yong Wu, Sunnyvale, CA (US);
Abhijit Basu Mallick, Palo Alto, CA (US);
Srinivas Gandikota, Santa Clara, CA (US);
Assignee:
APPLIED MATERIALS, INC., Santa Clara, CA (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 21/285 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02532 (2013.01); H01L 21/0257 (2013.01); H01L 21/0262 (2013.01); H01L 21/02488 (2013.01); H01L 21/02592 (2013.01); H01L 21/28556 (2013.01); H01L 21/28568 (2013.01);
Abstract
Methods for depositing a metal film on a doped amorphous silicon layer as a nucleation layer and/or a glue layer on a substrate. Some embodiments further comprise the incorporation of a glue layer to increase the ability of the doped amorphous silicon layer and metal layer to stick to the substrate.