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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11242425 B1

PDFFull Text
Date of Patent:
Feb. 08, 2022

Filed:

Apr. 22, 2019

Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate

Applicant:

Panasonic Intellectual Property Management Co., Ltd., Osaka, JP;

Inventors:

Mikio Sato, Osaka, JP;

Hiroaki Fujiwara, Nara, JP;

Yuki Kitai, Osaka, JP;

Masashi Koda, Fukushima, JP;

Yasunori Hoshino, Osaka, JP;

Takayoshi Ozeki, Osaka, JP;

Assignee:

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD., Osaka, JP;

Attorney:

Greenblum & Bernstein, P.L.C.

Primary Examiner:

Ian A Rummel

Int. Cl.
CPC ...
C08F 290/06 (2006.01); C08J 5/24 (2006.01); B32B 15/08 (2006.01); B32B 27/28 (2006.01); H05K 1/03 (2006.01);
U.S. Cl.
CPC ...
C08F 290/062 (2013.01); B32B 15/08 (2013.01); B32B 27/285 (2013.01); C08J 5/244 (2021.05); H05K 1/0366 (2013.01); C08J 2371/12 (2013.01);
Abstract

A resin composition is provided and contains a compound (A) having at least one group represented by the following Formula (1) in a molecule, a crosslinking type curing agent (B), and an azo compound (C) that has an azo group in a molecule and has no heteroatom other than a nitrogen atom constituting the azo group. In Formula (1), n represents 0 to 10, Z represents an arylene group, and Rto Reach independently represent a hydrogen atom or an alkyl group.

Find Patent Forward Citations

Sato, Mikio. (2022). Resin composition, prepreg, resin-added film, resin-added metal foil, metal-clad layered plate, and wiring plate (U.S. Patent No. 11242425). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11242425

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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