The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

May. 14, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Karthikeyan Balaraman, Bangalore, IN;

Balamurugan Ramasamy, Bangalore, IN;

Kartik Shah, Saratoga, CA (US);

Mats Larsson, Sunnyvale, CA (US);

Kevin A. Papke, Portland, OR (US);

Rajasekhar Patibandla, Bangalore, IN;

Sathyanarayana Bindiganavale, Bengaluru, IN;

Umesh M. Kelkar, Santa Clara, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/285 (2006.01); H01L 21/768 (2006.01); H01L 21/02 (2006.01); H01J 37/32 (2006.01); C23C 28/04 (2006.01);
U.S. Cl.
CPC ...
H01J 37/32477 (2013.01); C23C 28/042 (2013.01); H01J 37/32467 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01);
Abstract

Embodiments of the present disclosure provide protective coatings, i.e., diffusion and thermal barrier coatings, for aluminum alloy substrates. In particular, embodiments described herein provide a protective layer stack comprising a tantalum nitride layer disposed on an aluminum alloy substrate and a ceramic layer disposed on the tantalum nitride layer. In some embodiments, the aluminum alloy substrates comprise processing chambers and processing chamber components used in the field of electronic device manufacturing, e.g., semiconductor device manufacturing. In one embodiment, an article includes a substrate, a tantalum nitride layer disposed on the substrate, and a ceramic layer disposed on the tantalum nitride layer.


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