The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Dec. 12, 2018
Applicant:

Tokyo Electron Limited, Tokyo, JP;

Inventors:

Kennan Mo, Nirasaki, JP;

Nuri Choi, Nirasaki, JP;

Kouichi Sekido, Nirasaki, JP;

Katsumasa Yamaguchi, Nirasaki, JP;

Eiichi Komori, Nirasaki, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C23C 16/52 (2006.01); H01L 21/285 (2006.01); H01L 21/66 (2006.01); C23C 16/455 (2006.01); G05D 11/00 (2006.01);
U.S. Cl.
CPC ...
C23C 16/52 (2013.01); C23C 16/45525 (2013.01); G05D 11/00 (2013.01); H01L 21/28506 (2013.01); H01L 22/20 (2013.01);
Abstract

A method of processing each of a plurality of substrates comprises: obtaining a first correction factor based on a first flow rate set value of a mass flow controller and a first measurement value of a mass flow meter; adjusting the first flow rate set value of the mass flow controller with the first correction factor so that the flow rate of the vaporized raw material becomes equal to a target value to process the substrate; obtaining a second correction factor based on a second flow rate set value of the mass flow controller and a second measurement value of the mass flow meter; and adjusting the second flow rate set value of the mass flow controller with the second correction factor so that the flow rate of the vaporized raw material becomes equal to the target value to process the substrate.


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