The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Dec. 09, 2015
Texas Instruments Incorporated, Dallas, TX (US);
Ronaldo Marasigan Arguelles, Baguio, PH;
Edgar Dorotayo Balidoy, Benguet, PH;
Gloria Bibal Manaois, Baguio, PH;
Bernard Kaebin Andres Ancheta, Quirino, PH;
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A flip-chip on leadframe package includes a leadframe having a plurality of leads with each lead including an inner leadfinger portion, wherein at least a landing region of all of the inner leadfinger portions are in a single common level (or plane) and include etched areas providing bump pads having concave landing sites (landing sites). A semiconductor die (die) having an active top side surface with functional circuitry including bond pads has bumps or pillars thereon. An area of the landing sites is greater than an area of the bumps or pillars. A distal end of the bumps or pillars is within and electrically coupling to the landing sites. A mold material encapsulates the die and at least a portion of the inner leadfinger portions. The package can be a leaded package or a leadless package.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile