Edgar Dorotayo Balidoy

Title: Innovations of Edgar Dorotayo Balidoy

Introduction

Edgar Dorotayo Balidoy is a notable inventor based in Benguet, Philippines. He has made significant contributions to the field of semiconductor packaging, holding three patents to his name. His work primarily focuses on enhancing the efficiency and functionality of electronic components.

Latest Patents

One of Balidoy's latest patents is titled "Flip-chip on leadframe having partially etched landing sites." This invention involves a flip-chip on leadframe package that features a leadframe with multiple leads. Each lead includes an inner leadfinger portion, where the landing regions are designed to be on a single common level. The etched areas provide bump pads with concave landing sites, ensuring effective electrical coupling with the semiconductor die. Another significant patent is "Lead frame strip for reduced mold sticking during degating." This innovation includes an array of sites connected to exterior side rails, designed to improve the manufacturing process by reducing mold sticking during degating.

Career Highlights

Edgar Balidoy is currently employed at Texas Instruments Corporation, a leading company in the semiconductor industry. His role involves developing advanced packaging solutions that enhance the performance of electronic devices. His expertise in semiconductor technology has positioned him as a valuable asset to his team.

Collaborations

Throughout his career, Balidoy has collaborated with talented individuals such as Norbert Joson Santos and Anthony Steven Dominisac Panagan. These collaborations have fostered innovation and contributed to the successful development of new technologies in the semiconductor field.

Conclusion

Edgar Dorotayo Balidoy's contributions to semiconductor packaging through his patents and work at Texas Instruments Corporation highlight his innovative spirit and dedication to advancing technology. His inventions continue to impact the industry positively.