The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Dec. 12, 2019
Applicant:
Shinko Electric Industries Co., Ltd., Nagano, JP;
Inventors:
Shota Miki, Nagano, JP;
Naoki Kobayashi, Nagano, JP;
Assignee:
SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/34 (2006.01); H01L 23/48 (2006.01); H01L 23/28 (2006.01); H01L 21/00 (2006.01); H01L 21/44 (2006.01); H05K 1/00 (2006.01); H05K 1/14 (2006.01); H05K 7/00 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/522 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49822 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/522 (2013.01); H01L 24/13 (2013.01); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/17 (2013.01); H01L 24/29 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/50 (2013.01);
Abstract
An interconnect board includes: a first substrate; a second substrate having an outer shape smaller than an outer shape of the first substrate and mounted on the first substrate; and an adhesive layer bonding the first substrate and the second substrate together and having a fillet contacting a side surface of the second substrate. The fillet has a raised portion raised from a level of a top surface of the second substrate to a level higher than the top surface of the second substrate.