The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 25, 2022

Filed:

Dec. 03, 2018
Applicant:

Semiconductor Energy Laboratory Co., Ltd., Kanagawa-ken, JP;

Inventors:

Masataka Sato, Tochigi, JP;

Kayo Kumakura, Tochigi, JP;

Seiji Yasumoto, Tochigi, JP;

Satoru Idojiri, Tochigi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/02 (2006.01); H01L 27/32 (2006.01); C03C 17/36 (2006.01); C03C 17/38 (2006.01); H01L 29/786 (2006.01); H01L 51/56 (2006.01); H01L 27/12 (2006.01); H01L 51/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/02252 (2013.01); C03C 17/3626 (2013.01); C03C 17/3649 (2013.01); C03C 17/38 (2013.01); H01L 21/02244 (2013.01); H01L 27/1262 (2013.01); H01L 27/322 (2013.01); H01L 29/7869 (2013.01); H01L 51/003 (2013.01); H01L 51/56 (2013.01); C03C 2217/258 (2013.01); C03C 2217/281 (2013.01); C03C 2218/154 (2013.01); C03C 2218/31 (2013.01); C03C 2218/32 (2013.01); H01L 27/1225 (2013.01); H01L 51/0097 (2013.01); H01L 2227/323 (2013.01); H01L 2227/326 (2013.01);
Abstract

A method of fabricating a semiconductor device, which includes a separation step and has a high yield, is provided. A metal layer is formed over a substrate, fluorine is supplied to the metal layer, and the metal layer is then oxidized, whereby a metal compound layer is formed. A functional layer is formed over the metal compound layer, heat treatment is performed on the metal compound layer, and the functional layer is separated from the substrate with use of the metal compound layer. By performing first plasma treatment using a gas containing fluorine, fluorine can be supplied to the metal layer. By performing second plasma treatment using a gas containing oxygen, the metal layer supplied with fluorine can be oxidized.


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