The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 25, 2022
Filed:
Apr. 15, 2020
Applicant:
Taiwan Semiconductor Manufacturing Company Ltd., Hsinchu, TW;
Inventors:
Assignee:
TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD., Hsinchu, TW;
Primary Examiner:
Int. Cl.
CPC ...
G01N 21/95 (2006.01); G01N 21/956 (2006.01); G01N 21/88 (2006.01); G06T 7/00 (2017.01);
U.S. Cl.
CPC ...
G01N 21/9505 (2013.01); G01N 21/8851 (2013.01); G01N 21/956 (2013.01); G06T 7/0004 (2013.01); G01N 2021/8864 (2013.01); G06T 2207/30148 (2013.01);
Abstract
A method for semiconductor wafer inspection is provided. The method includes the following operations. The semiconductor wafer is scanned to acquire a scanned map, wherein the semiconductor wafer is patterned according to a design map having a programmed defect. The design map and the scanned map are transformed to a transformed inspection map according to the location of the programmed defect on the design map and the location of the programmed defect on the scanned map. The system of semiconductor wafer inspection is also provided.