The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Oct. 30, 2015
Applicant:

Laird Technologies, Inc., Earth City, MO (US);

Inventors:

Hoang Dinh Do, Canton, MA (US);

Robert Howard Boutier, Jr., Westport, MA (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); H05K 9/00 (2006.01);
U.S. Cl.
CPC ...
H05K 9/0081 (2013.01); C09K 5/14 (2013.01); H05K 9/0083 (2013.01);
Abstract

According to various aspects, exemplary embodiments are disclosed of thermally-conductive EMI absorbers that generally includes thermally-conductive particles, EMI absorbing particles, and silicon carbide. The silicon carbide is present in an amount sufficient to synergistically enhance thermal conductivity and/or EMI absorption. By way of example, an exemplary embodiment of a thermally-conductive EMI absorber may include silicon carbide, magnetic flakes, manganese zinc ferrite, alumina, and carbonyl iron.


Find Patent Forward Citations

Do, Hoang. (2022). Thermally-conductive electromagnetic interference (emi) absorbers with silicon carbide (U.S. Patent No. 11229147). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11229147

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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