The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Aug. 23, 2019
Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Yung-Fu Chang, Hsinchu, TW;

Fan-Lei Wu, Hsinchu, TW;

Shih-Chang Lee, Hsinchu, TW;

Wen-Luh Liao, Hsinchu, TW;

Hung-Ta Cheng, Hsinchu, TW;

Chih-Chaing Yang, Hsinchu, TW;

Yao-Ru Chang, Hsinchu, TW;

Yi Hsiao, Hsinchu, TW;

Hsiang Chang, Hsinchu, TW;

Assignee:

Epistar Corporation, Hsinchu, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/20 (2010.01);
U.S. Cl.
CPC ...
H01L 33/20 (2013.01);
Abstract

A semiconductor structure includes a carrier having a surface, a supporting element, a semiconductor stack and a bridge layer. The supporting element is on the surface. The semiconductor stack is on the surface and has a side surface. The bridge layer includes a first portion connecting to the supporting element, a second portion, and a third portion connecting to the semiconductor stack. The second portion is extended from the third portion toward the first portion and is protruded from the side surface.


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