The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Aug. 06, 2020
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Armin Saeedi Vahdat, Boise, ID (US);

John A. Smythe, III, Boise, ID (US);

Si-Woo Lee, Boise, ID (US);

Gurtej S. Sandhu, Boise, ID (US);

Scott E. Sills, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 27/108 (2006.01); H01L 29/66 (2006.01); H01L 29/06 (2006.01); H01L 29/24 (2006.01); H01L 29/786 (2006.01); H01L 21/02 (2006.01); H01L 29/423 (2006.01);
U.S. Cl.
CPC ...
H01L 27/10805 (2013.01); H01L 21/0262 (2013.01); H01L 21/02565 (2013.01); H01L 21/02568 (2013.01); H01L 21/02603 (2013.01); H01L 27/1085 (2013.01); H01L 27/10873 (2013.01); H01L 27/10888 (2013.01); H01L 29/0673 (2013.01); H01L 29/24 (2013.01); H01L 29/66969 (2013.01); H01L 29/7869 (2013.01); H01L 29/78618 (2013.01); H01L 29/78696 (2013.01); H01L 29/42392 (2013.01);
Abstract

Systems, methods and apparatus are provided for storage node after horizontally oriented, three-node access device formation in vertical three dimensional (3D) memory. An example method includes a method for forming arrays of vertically stacked memory cells, having horizontally oriented access devices and vertically oriented access lines. The method includes forming elongated vertical, pillar columns with sidewalls in a vertical stack. A first conductive material is conformally deposited on a gate dielectric material in the first vertical openings. Portions of the first conductive material are removed to form a plurality of separate, vertical access lines along the sidewalls of the elongated vertical, pillar columns. A second vertical opening is formed through the vertical stack to expose a first region of the sacrificial material. A third vertical opening is formed through the vertical stack to in which to form a storage node electrically coupled to the first source/drain material.


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