The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 18, 2022

Filed:

Jul. 30, 2020
Applicant:

Samsung Electronics Co., Ltd., Suwon-si, KR;

Inventors:

Jooyong Park, Hwaseong-si, KR;

Chanho Kim, Seoul, KR;

Daeseok Byeon, Seongnam-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/522 (2006.01); H01L 25/18 (2006.01); H01L 25/065 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 24/05 (2013.01); H01L 24/08 (2013.01); H01L 25/0657 (2013.01); H01L 2224/05147 (2013.01); H01L 2224/08145 (2013.01); H01L 2924/1431 (2013.01); H01L 2924/14511 (2013.01);
Abstract

A memory device includes a memory cell chip, a peripheral circuit chip, and a routing wire. The memory cell chip includes a memory cell array disposed on a first substrate, and a first metal pad on a first uppermost metal layer. The peripheral circuit chip includes circuit devices disposed on a second substrate, and a second metal pad on a second uppermost metal layer of the peripheral circuit chip. The memory cell chip and the peripheral circuit chip are vertically connected to each other by the first metal pad and the second metal pad in a bonding area. The routing wire is electrically connected to the peripheral circuit and is disposed in the first uppermost metal layer or the second uppermost metal layer and is disposed in a non-bonding area in which the memory cell chip and the peripheral circuit chip are not electrically connected to each other.


Find Patent Forward Citations

Loading…