The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 18, 2022
Filed:
May. 04, 2020
Applicant:
Nexperia B.v., Nijmegen, NL;
Inventors:
Kan Wae Lam, Nijmegen, NL;
Wai Hung William Hor, Nijmegen, NL;
Sven Walczyk, Nijmegen, NL;
Hans-Juergen Funke, Nijmegen, NL;
Assignee:
Nexperia B.V., Nijmegen, NL;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/49 (2006.01); H01L 23/495 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49565 (2013.01); H01L 21/561 (2013.01); H01L 23/3121 (2013.01); H01L 23/49527 (2013.01); H01L 24/45 (2013.01); H01L 24/85 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01);
Abstract
This disclosure relates to a flank wettable semiconductor device, having: a lead frame including a plurality of leads with a lead end portion and a semiconductor die mounted on the lead frame. The lead end portion comprises a recess portion having a height that corresponds to a thickness of the lead end portion, and a plate member mounted on the leadframe at the lead end portion.